Assemble simple to highly complex assemblies in any quantity. Consignment, turnkey, prototype to production. Box build and functional test available. Extensive experience with BGA and leadless (QFN, DFN etc.) packages. Lead-free and tin/lead processing. Flex and rigid-flex assembly capability.

SMT Equipment:

Solder Paste Printing     -(2) DEK 265GSX with screen cleaner.

High Speed Placement  -(3) Universal 4790/4791 HSP, (1) Universal 4797L HSP

Flexible Placement        -(2) Universal GSM with PTF

Ovens                              -(2) Micro-Tool convection reflow ovens

AOI                                - Yestech F1 AOI with Hi-Mag option

ASSEMBLY SERVICES

Other Equipment:

Hot Bar Soldering        -Unitek Miyachi